Silver Conductive Adhesive Paste

Curing Temperature: ~100℃

Silver Conductive Adhesive Paste is specifically formulated for screen printing applications on polymer substrates such as PET and PE. It provides excellent electrical conductivity, smooth printability, and strong adhesion. The paste cures rapidly at low temperatures, ensuring compatibility with heat-sensitive substrates. Once processed, it delivers durable performance with reliable adhesion and mechanical stability, making it suitable for flexible and rigid electronic designs.

Technical Properties

Applications

• Screen Printing of Conductive Patterns: Optimized for use with 200–300 mesh stainless steel or polyester screens, enabling precise deposition of conductive traces.
• Polymer Substrate Electronics: Suitable for PET, PE, and similar flexible substrates where low‑temperature curing prevents thermal damage.
• Flexible Circuits and Wearable Devices: Provides reliable conductivity and adhesion in bendable electronic architectures.
• Printed Sensors and Low‑Power Devices: Applicable in electrode formation for sensors requiring stable electrical performance on polymer films.
• Display and Packaging Components: Can be integrated into printed interconnects for lightweight display modules or compact packaging designs.
• Prototyping and Custom Electronics: Useful for rapid fabrication of conductive layouts in research and development environments.